Global IoT Wireless Communication Chip Market Growth Forecast Report 2026-2032
公開 2026/01/21 10:40
最終更新
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On Jan 21, the latest report "Global IoT Wireless Communication Chip Market 2026 by Manufacturers, Regions, Types and Applications, Forecast to 2032" from Global Info Research provides a detailed and comprehensive analysis of the global IoT Wireless Communication Chip market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2026.
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According to our (Global Info Research) latest study, the global IoT Wireless Communication Chip market size was valued at US$ 15107 million in 2025 and is forecast to a readjusted size of US$ 37048 million by 2032 with a CAGR of 13.7% during review period.
IoT Wireless Communication Chips refer to semiconductor devices that provide wireless link establishment, data transmission and reception, and network access capabilities for IoT terminals, gateways, and edge nodes. Their core function is to enable wireless communication between devices, between devices and gateways, and between devices and the cloud in different IoT scenarios. They typically support one or more mainstream wireless standards and protocol stacks, such as Wi-Fi, Bluetooth/BLE, IEEE 802.15.4 (Zigbee/Thread/Matter related), Sub-GHz proprietary protocols, LPWAN (such as LoRa), and cellular IoT (NB-IoT, LTE-M, Cat.1bis, etc.), and can be equipped with supporting capabilities such as network configuration, roaming, networking (star or mesh), power management, and connection security. In terms of product form and statistical scope, IoT wireless communication chips generally refer to wireless system-on-a-chip (SoC) or multi-protocol wireless MCUs that integrate functions such as radio frequency transceivers (RF), baseband, storage, microcontrollers (MCUs), encryption, and protocol stacks. These chips support multiple wireless protocols, such as Wi-Fi, Bluetooth/BLE, Zigbee, and Thread, and enable wireless connectivity for IoT devices. Most modern IoT wireless chips integrate radio frequency and other processing modules into a single chip, simplifying design and improving system efficiency. Market statistics typically use the shipment volume or sales revenue of "chips/SoCs/combined chips for IoT connectivity" as the accounting unit. In 2025, global IoT wireless communication chip production reached 5,521.83 million units, with an average price of approximately US.66 per unit and a gross profit margin of 20.05%-55.26%. Downstream customers include Apple, Google, Amazon, Xiaomi, Logitech, Lenovo, Skyworth, Changhong, Haier, JBL, Sony, and Narwal.
From a competitive landscape perspective, core manufacturers of IoT wireless communication chips mainly include Qualcomm, Texas Instruments, Semtech Corporation, Nordic Semiconductor, and Renesas Electronics, while also covering key players such as Broadcom, MediaTek, Realtek, NXP, Infineon, and STMicroelectronics. In 2024, industry concentration was high, with the top ten manufacturers accounting for approximately 71.0% of the market share. The leading global manufacturers were primarily Broadcom, Qualcomm, and MediaTek, holding a combined market share of approximately 30.2%. The second tier of manufacturers included Realtek, NXP, Infineon, and Renesas Electronics, holding a combined market share of approximately 27.0%. As leading manufacturers continue to strengthen their advantages in multi-protocol platform SoCs, ecosystems and channels, and customer certification systems, market share will continue to concentrate on the top players in the short term. However, in high-growth regions like China, structural substitution will accelerate the redistribution of market share. From a regional perspective, the Chinese market is one of the core variables determining global economic conditions and market share changes. In 2024, the Chinese market size was US,770.67 million, accounting for approximately 36.3% of the global market; it is projected to reach US,742.03 million by 2031, increasing its global share to 38.8%. Strong consumer demand will further accelerate local supply chain collaboration and the pace of domestic substitution, making the Chinese market one of the most competitive and fastest-evolving regions for products in the coming years. In terms of product type and technological evolution, Bluetooth and Bluetooth Low Energy (BLE) remain the most prevalent technologies (approximately 57.3% share in 2024, projected to reach 52.5% in 2031), with advantages in ultra-low power consumption and a mature ecosystem. Meanwhile, the share of Wi-Fi IoT continues to increase (approximately 21.7% in 2024, projected to reach 23.6% in 2031), primarily benefiting from the growth in direct-connect networks and the demand for higher bandwidth. Multi-protocol interconnectivity, represented by Zigbee/Thread/Matter, is steadily increasing its market share under the trend of "platformization" in smart homes (approximately 9.9% by 2031), while cellular and LPWAN routes are more reflected in structural growth in specific industry scenarios. From the application perspective, smart homes remain the core scenario for large-scale deployment, with a stable market share of approximately 34.1% in 2024. Revenue is projected to grow at a CAGR of approximately 14.2% from 2025 to 2031, continuing to benefit from home network upgrades, increased demand for cross-brand interconnectivity, and the penetration of multi-protocol integrated SoCs. Overall, industry competition will intensify in the coming years, especially in the Chinese market, where price, delivery, and ecosystem integration will jointly determine market share changes. Long-term winners will primarily depend on low power consumption and RF performance, protocol stacks and software ecosystems, platform-based product iteration efficiency, and the ability to replicate success on a large scale with leading customers and channel systems.
This report is a detailed and comprehensive analysis for global IoT Wireless Communication Chip market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
IoT Wireless Communication Chip market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: BLE、 Wi-Fi IoT、 Zigbee/Thread/Matter、 Cellular IoT、 LoRaWAN IoT、 Others
Market segment by Application: Smart Home、 Smart Healthcare、 Retail Logistics、 Consumer Electronics、 Automotive Electronics、 Other
Major players covered: Broadcomm、 Qualcomm、 Texas Instruments、 Semtech Corporation、 Nordic Semiconductor、 Renesas Electronics (Dialog Semiconductor)、 Silicon Labs、 NXP Semiconductors、 STMicroelectronics、 Realtek Semiconductor Corporation、 Infineon、 Microchip Technology、 Toshiba、 Sequans、 Onsemi、 MediaTek、 Qorvo、 UNISOC、 Telink Semiconductor (shanghai)co.,ltd.、 Shenzhen HiSilicon Technologies、 ASR Microelectronics Co., Ltd.、 Zhuhai All Winner Technology、 Espressif Systems、 Beken Corporation
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IoT Wireless Communication Chip product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IoT Wireless Communication Chip, with price, sales quantity, revenue, and global market share of IoT Wireless Communication Chip from 2021 to 2026.
Chapter 3, the IoT Wireless Communication Chip competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IoT Wireless Communication Chip breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment IoT Wireless Communication Chip the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the IoT Wireless Communication Chip sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2025.and IoT Wireless Communication Chip market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IoT Wireless Communication Chip.
Chapter 14 and 15, to describe IoT Wireless Communication Chip sales channel, distributors, customers, research findings and conclusion.
Get Report Sample with Industry Insights https://www.globalinforesearch.com/reports/3401926/iot-wireless-communication-chip
According to our (Global Info Research) latest study, the global IoT Wireless Communication Chip market size was valued at US$ 15107 million in 2025 and is forecast to a readjusted size of US$ 37048 million by 2032 with a CAGR of 13.7% during review period.
IoT Wireless Communication Chips refer to semiconductor devices that provide wireless link establishment, data transmission and reception, and network access capabilities for IoT terminals, gateways, and edge nodes. Their core function is to enable wireless communication between devices, between devices and gateways, and between devices and the cloud in different IoT scenarios. They typically support one or more mainstream wireless standards and protocol stacks, such as Wi-Fi, Bluetooth/BLE, IEEE 802.15.4 (Zigbee/Thread/Matter related), Sub-GHz proprietary protocols, LPWAN (such as LoRa), and cellular IoT (NB-IoT, LTE-M, Cat.1bis, etc.), and can be equipped with supporting capabilities such as network configuration, roaming, networking (star or mesh), power management, and connection security. In terms of product form and statistical scope, IoT wireless communication chips generally refer to wireless system-on-a-chip (SoC) or multi-protocol wireless MCUs that integrate functions such as radio frequency transceivers (RF), baseband, storage, microcontrollers (MCUs), encryption, and protocol stacks. These chips support multiple wireless protocols, such as Wi-Fi, Bluetooth/BLE, Zigbee, and Thread, and enable wireless connectivity for IoT devices. Most modern IoT wireless chips integrate radio frequency and other processing modules into a single chip, simplifying design and improving system efficiency. Market statistics typically use the shipment volume or sales revenue of "chips/SoCs/combined chips for IoT connectivity" as the accounting unit. In 2025, global IoT wireless communication chip production reached 5,521.83 million units, with an average price of approximately US.66 per unit and a gross profit margin of 20.05%-55.26%. Downstream customers include Apple, Google, Amazon, Xiaomi, Logitech, Lenovo, Skyworth, Changhong, Haier, JBL, Sony, and Narwal.
From a competitive landscape perspective, core manufacturers of IoT wireless communication chips mainly include Qualcomm, Texas Instruments, Semtech Corporation, Nordic Semiconductor, and Renesas Electronics, while also covering key players such as Broadcom, MediaTek, Realtek, NXP, Infineon, and STMicroelectronics. In 2024, industry concentration was high, with the top ten manufacturers accounting for approximately 71.0% of the market share. The leading global manufacturers were primarily Broadcom, Qualcomm, and MediaTek, holding a combined market share of approximately 30.2%. The second tier of manufacturers included Realtek, NXP, Infineon, and Renesas Electronics, holding a combined market share of approximately 27.0%. As leading manufacturers continue to strengthen their advantages in multi-protocol platform SoCs, ecosystems and channels, and customer certification systems, market share will continue to concentrate on the top players in the short term. However, in high-growth regions like China, structural substitution will accelerate the redistribution of market share. From a regional perspective, the Chinese market is one of the core variables determining global economic conditions and market share changes. In 2024, the Chinese market size was US,770.67 million, accounting for approximately 36.3% of the global market; it is projected to reach US,742.03 million by 2031, increasing its global share to 38.8%. Strong consumer demand will further accelerate local supply chain collaboration and the pace of domestic substitution, making the Chinese market one of the most competitive and fastest-evolving regions for products in the coming years. In terms of product type and technological evolution, Bluetooth and Bluetooth Low Energy (BLE) remain the most prevalent technologies (approximately 57.3% share in 2024, projected to reach 52.5% in 2031), with advantages in ultra-low power consumption and a mature ecosystem. Meanwhile, the share of Wi-Fi IoT continues to increase (approximately 21.7% in 2024, projected to reach 23.6% in 2031), primarily benefiting from the growth in direct-connect networks and the demand for higher bandwidth. Multi-protocol interconnectivity, represented by Zigbee/Thread/Matter, is steadily increasing its market share under the trend of "platformization" in smart homes (approximately 9.9% by 2031), while cellular and LPWAN routes are more reflected in structural growth in specific industry scenarios. From the application perspective, smart homes remain the core scenario for large-scale deployment, with a stable market share of approximately 34.1% in 2024. Revenue is projected to grow at a CAGR of approximately 14.2% from 2025 to 2031, continuing to benefit from home network upgrades, increased demand for cross-brand interconnectivity, and the penetration of multi-protocol integrated SoCs. Overall, industry competition will intensify in the coming years, especially in the Chinese market, where price, delivery, and ecosystem integration will jointly determine market share changes. Long-term winners will primarily depend on low power consumption and RF performance, protocol stacks and software ecosystems, platform-based product iteration efficiency, and the ability to replicate success on a large scale with leading customers and channel systems.
This report is a detailed and comprehensive analysis for global IoT Wireless Communication Chip market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
IoT Wireless Communication Chip market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: BLE、 Wi-Fi IoT、 Zigbee/Thread/Matter、 Cellular IoT、 LoRaWAN IoT、 Others
Market segment by Application: Smart Home、 Smart Healthcare、 Retail Logistics、 Consumer Electronics、 Automotive Electronics、 Other
Major players covered: Broadcomm、 Qualcomm、 Texas Instruments、 Semtech Corporation、 Nordic Semiconductor、 Renesas Electronics (Dialog Semiconductor)、 Silicon Labs、 NXP Semiconductors、 STMicroelectronics、 Realtek Semiconductor Corporation、 Infineon、 Microchip Technology、 Toshiba、 Sequans、 Onsemi、 MediaTek、 Qorvo、 UNISOC、 Telink Semiconductor (shanghai)co.,ltd.、 Shenzhen HiSilicon Technologies、 ASR Microelectronics Co., Ltd.、 Zhuhai All Winner Technology、 Espressif Systems、 Beken Corporation
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IoT Wireless Communication Chip product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IoT Wireless Communication Chip, with price, sales quantity, revenue, and global market share of IoT Wireless Communication Chip from 2021 to 2026.
Chapter 3, the IoT Wireless Communication Chip competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IoT Wireless Communication Chip breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment IoT Wireless Communication Chip the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the IoT Wireless Communication Chip sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2025.and IoT Wireless Communication Chip market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IoT Wireless Communication Chip.
Chapter 14 and 15, to describe IoT Wireless Communication Chip sales channel, distributors, customers, research findings and conclusion.
